BGA Solder Balls Containing 0.25mm Leads Sn63Pb37

Searching for BGA Solder Balls Containing 0.25mm Leads Sn63Pb37? You've come to the right place. These solder balls are essential components in electronics manufacturing, serving as interconnects between printed circuit boards (PCBs) and integrated circuit (IC) packages. They are placed on PCB pads and reflowed to establish electrical connections.

The Sn63Pb37 lead alloy used in these solder balls offers a superior combination of mechanical and electrical properties. This eutectic alloy melts at 183°C, ensuring a strong and reliable bond between PCB pads and IC packages.

The 0.25mm size of these solder balls is a standard in electronics manufacturing, making them suitable for a wide range of applications. This size provides an optimal balance between stability and electrical performance, making it ideal for consumer electronics, computer systems, telecommunications equipment, and more.

Features of BGA Solder Balls Containing 0.25mm Sn63Pb37:

• Standard Size: The 0.25mm size is widely used in electronics manufacturing, ensuring availability and ease of use.
• Wide Range of Applications: These solder balls are used in various applications, including consumer electronics, computer systems, and telecommunications equipment.
• Cost-effective: The Sn63Pb37 alloy offers a good balance of performance, reliability, and cost, making it a popular choice in the electronics industry.

Why Choose BGA Solder Balls Containing 0.25mm Leads Sn63Pb37?

• We offer premium-quality BGA solder balls at competitive prices.
• Our customer service is unmatched, ensuring you are in good hands.
• We prioritize customer satisfaction, providing a delightful experience and addressing any issues promptly.