BGA Solder Balls Containing 0.35mm Leads Sn63Pb37

BGA (Ball Grid Array) solder balls are small spherical balls of solder used in electronics manufacturing as interconnects between a printed circuit board (PCB) and an integrated circuit (IC) package. The solder balls are placed on the PCB pads, and the IC package is positioned on top and reflowed to make the electrical connections.

Solder balls containing Sn63Pb37 lead are commonly used in electronics manufacturing due to the excellent combination of mechanical and electrical properties provided by the Sn63Pb37 lead alloy. This eutectic alloy melts at 183°C, ensuring a strong and reliable bond between the PCB pads and the IC package.

The 0.35mm size of the solder balls is a standard size widely used in electronics manufacturing. This size offers a good balance between stability and electrical performance, making it suitable for various applications, including consumer electronics, computer systems, and telecommunications equipment.

Features of BGA Solder Balls Containing 0.35mm Sn63Pb37:

• Standard Size: The 0.35mm size is widely used in electronics manufacturing, making these solder balls widely available and easy to use.
• Wide Range of Applications: These solder balls are used in various applications, including consumer electronics, computer systems, and telecommunications equipment.
• Reliable Performance: The Sn63Pb37 alloy provides a strong and reliable bond, ensuring optimal performance in electronic devices.