BGA Solder Balls Containing 0.45mm Leads Sn63Pb37

BGA (Ball Grid Array) solder balls are small spherical balls of solder used in electronics manufacturing as interconnects between a printed circuit board (PCB) and an integrated circuit (IC) package. The solder balls are placed on the PCB pads and then the IC package is positioned on top and reflowed to make the electrical connections.

Solder balls containing Sn63Pb37 lead are commonly used in electronics manufacturing because of the good combination of mechanical and electrical properties that the Sn63Pb37 lead alloy provides. The Sn63Pb37 lead alloy is a eutectic (meaning it has a single melting point) alloy that melts at 183°C and provides a strong and reliable bond between the PCB pads and the IC package.

The 0.45mm size of the solder balls is a standard size that is commonly used in electronics manufacturing and is suitable for most applications. This size provides a good balance between stability and electrical performance and is widely used in a range of applications, including consumer electronics, computer systems, telecommunications equipment, and many others.

Features of BGA Solder Balls Containing 0.45mm Sn63Pb37:

• Standard Size: The 0.45mm size of the solder balls is a standard size that is commonly used in electronics manufacturing, which makes them widely available and easy to use.
• Wide Range of Applications: BGA Solder Balls Containing 0.45mm Leads Sn63Pb37 are widely used in a range of applications, including consumer electronics, computer systems, telecommunications equipment, and many others.
• Cost-effective: The combination of good performance, reliability, and low cost make Sn63Pb3 a popular choice for BGA solder balls in the electronics industry.